Part Variation Modeling to Avoid Scrap Parts in Multi-stage Production Systems

Manufacturing systems for today's products are complex systems requiring a variety of different processes in order to be able to manufacture all necessary part features. This also applies to the production of rotating components, which have experienced increasing demand at the latest due to the growth in mobility. As in almost every manufacturing process, quality-reducing defects can occur due to deviations for example tool wear, which cannot always be avoided. Those, that have accumulated from previous process steps can cause the occurrence of superimposed defects. This leads to complex relationships between quality defects in the end product and the numerous parameters of the manufacturing processes. To remain competitive, production must be optimized in order to identify defects as early as possible, as well as their dependencies and variation patterns. The paper presents an approach to identify and model part variations within multi-stage production systems. Subsequently, based on a detected deviation, a downstream compensation strategy can be proposed at an early stage of the manufacturing process, which uses the capability of the overall system to fundamentally eliminate rejects

Radiation Tolerance of CMOS Monolithic Active Pixel Sensors with Self-Biased Pixels

CMOS Monolithic Active Pixel Sensors (MAPS) are proposed as a technology for various vertex detectors in nuclear and particle physics. We discuss the mechanisms of ionizing radiation damage on MAPS hosting the the dead time free, so-called self bias pixel. Moreover, we discuss radiation hardened sensor designs which allow operating detectors after exposing them to irradiation doses above 1 Mra

Optimization of Tracking Performance of CMOS Monolithic Active Pixel Sensors

CMOS Monolithic Active Pixel Sensors (MAPS) provide an attractive solution for high precision tracking of minimum ionizing particles. In these devices, a thin, moderately doped, undepleted silicon layer is used as the active detector volume with the readout electronics implemented on top of it. Recently, a new MAPS prototype was fabricated using the AMS 0.35 $mu$m OPTO process, featuring a thick epitaxial layer. A systematic study of tracking performance of that prototype using high-energy particle beam is presented in this work. Noise performance, signal amplitude from minimum ionizing particles, detection efficiency, spurious hit suppression and spatial resolution are shown as a function of the readout pitch and the charge collecting diode size. A test array with a novel readout circuitry was also fabricated and tested. Each pixel circuit consists of a front-end voltage amplifier, capacitively coupled to the charge collecting diode, followed by two analog memory cells. This architecture implements an on-pixel correlated double sampling method, allowing for optimization of integration independently of full frame readout time and strongly reduces the pixel-to-pixel output signal dispersion. First measurements using this structure are also presented

Beam Test of Silicon Strip Sensors for the ZEUS Micro Vertex Detector

For the HERA upgrade, the ZEUS experiment has designed and installed a high precision Micro Vertex Detector (MVD) using single sided micro-strip sensors with capacitive charge division. The sensors have a readout pitch of 120 microns, with five intermediate strips (20 micron strip pitch). An extensive test program has been carried out at the DESY-II testbeam facility. In this paper we describe the setup developed to test the ZEUS MVD sensors and the results obtained on both irradiated and non-irradiated single sided micro-strip detectors with rectangular and trapezoidal geometries. The performances of the sensors coupled to the readout electronics (HELIX chip, version 2.2) have been studied in detail, achieving a good description by a Monte Carlo simulation. Measurements of the position resolution as a function of the angle of incidence are presented, focusing in particular on the comparison between standard and newly developed reconstruction algorithms.Comment: 41 pages, 21 figures, 2 tables, accepted for publication in NIM

TAB Bonded SSD Module for the STAR and ALICE Trackers

Presentation made at LEB99, 20-24 September 1999A novel compact detector module has been produced by the "IReS"-"Subatech"-"Thomson-CSF-Detexis" collaboration. It includes a Double-Sided (DS) Silicon Strip Detector (SSD) and the related Front End Electronics (FEE) located on two hybrids, one for the N side and one for the P side. Bumpless Tape Automated Bonding (TAB) is used to connect the detector to the hybrids by means of microcables with neither wirebonding nor pitch adapter. Each of the six dedicated ALICE128C FE chip [1], located on the hybrid, is TABed on identical single layer microcables, which connect its inputs to the DS SSD and its outputs to the hybrid [2]. These microcables are bent in order to fold over the two hybrids on the DS SSD. This module meets the specifications of two experiments, ALICE (A Large Ion Collider Experiment) on the LHC accelerator at CERN [3] and STAR (Solenoid Tracker At Rhic) on the RHIC accelerator at BNL (Brookhaven National Laboratory)[4]. It can be used with air cooling (STAR) as well as with water cooling (ALICE)[5]. This mechanically self-consistent FE module has been tested on the SPS beam at CERN. Preliminary results are presented

Production test of microstrip detector and electronic frontend modules for the STAR and ALICE trackers

We revisit Shin et al.’s leakage-resilient password-based authenticated key establishment protocol (LR-AKEP) and the security model used to prove the security of LR-AKEP. By refining the Leak oracle in the security model, we show that LR-AKE (1) can, in fact, achieve a stronger notion of leakage-resilience than initially claimed and (2) also achieve an additional feature of traceability, not previously mentioned